Built around a Pentium® processor PC host and industry standard vision hardware, these systems ensure long-term sustainability. The software runs on Microsoft® Windows® 2000/XP platforms and is highly user-friendly.
The pre-die and post-die inspection systems are designed to meet the needs of all Original Equipment Manufacturers (OEM) of the die bonding equipment and end-users. This system is capable of handling the entire spectrum of semiconductor lead frame sizes.
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